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DOW SE4420

Adhesive, Thermal Conductive, Polydimethylsiloxane, White, 0.92 W/m.K, 4.1 MPa, Cartridge, 330 ml

DOW SE4420

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SE4420   Datasheet
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Technical Documents (4)

Product Overview

The SE4420 is a Thermally Conductive Adhesive designed to provide efficient thermal transfer for the cooling of electronic modules, including telecom and power supply devices. One-part RTV-cure thermally conductive materials cure with moisture exposure to produce durable, relatively low-stress elastomer with a noncorrosive by-product. Electronic devices are continually designed to deliver higher performance. It is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of electronic devices is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal bridge to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink).
  • Semi-flowable
  • Fast tack-free time
  • Good adhesion
  • 8-minute Tack-free time at 25°C


Consumer Electronics, Communications & Networking, Power Management

Available to manufacturer lead time 10 weeks

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Due to market conditions delivery times are for general guidance only and may be subject to change at short notice

Hazardous Item

There may be additional transit time and delivery charges applied to this item which shall be notified to you after the order is placed but prior to despatch. Delivery of other items on your order will be unaffected.

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lei546.56 ( ex VAT  ) lei650.4064 ( inc VAT )

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