400001
Sample Kit, Thermal Interface Solution Envelop, Vertical
14 Vă puteți rezerva stocul acum
| Cantitate | Preț (fără TVA) |
|---|---|
| 1+ | 486,920 lei |
| 5+ | 477,160 lei |
| 10+ | 467,460 lei |
Detalii tehnice
Prezentare generală a produsului
Thermal interface solutions sample kit includes WE-TGF thermal gap filler pad (reinforced shape: square; 100 x 100 x 1mm, thermal conductivity = 1 W/(m⋅K)), WE-PCM phase change material (shape: square; 100 x 100 x 0.2mm, thermal conductivity = 1.6W/(m⋅K)), WE-TTT thermal transfer tape (shape: square; 100mm x 100mm x 0.2mm, thermal conductivity: <gt/>=1W/(m⋅K), dielectric strength: 4KV/mm, adhesive strength: <gt/>= 5.79N/cm), WE-TINS thermally conductive insulator pad (shape: square; 65 x 65 x 0.23mm, thermal conductivity = 1.6W/(m⋅K)).
- Vertical thermal interfaces envelop
- Fill a gap to provide a path for the heat energy to flow
Cuprins
WE-TGF thermal gap filler pad, WE-PCM phase change material, WE-TTT thermal transfer tape, WE-TINS thermally conductive insulator pad.
Specificaţii tehnice
-
-
WE-TGF Filler Pad, WE-TINS Insulator Pad, WE-PCM Thermal Phase Changing Material, WE-TTT Tape
No SVHC (21-Jan-2025)
Documentaţie tehnică (1)
Legislaţie şi reglementări privind protecţia mediului
Tara in care ultimul proces semnificativ de fabricare a fost efectuatŢara de origine:China
Tara in care ultimul proces semnificativ de fabricare a fost efectuat
RoHS
RoHS
Certificat de conformitate produs