BGA-STD-010
Heat Sink, For Ball Grid Array, Standard, 27 °C/W, BGA, 13.5 mm, 10 mm, 13 mm
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| Cantitate | Preț (fără TVA) |
|---|---|
| 1+ | 15,090 lei |
| 10+ | 11,480 lei |
| 25+ | 9,250 lei |
| 50+ | 8,690 lei |
| 100+ | 8,530 lei |
Detalii tehnice
Prezentare generală a produsului
The BGA-STD-010 is a 13mm standard Heat Sink with aluminium, black anodized, thermal tape, 27°C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.
- 0.27mm Thickness
Aplicaţii
HVAC
Specificaţii tehnice
27°C/W
13.5mm
13mm
Aluminium
0.39"
-
BGA
10mm
-
0.53"
0.51"
-
Documentaţie tehnică (1)
Produse asociate
4 produse găsite
Legislaţie şi reglementări privind protecţia mediului
Tara in care ultimul proces semnificativ de fabricare a fost efectuatŢara de origine:Great Britain
Tara in care ultimul proces semnificativ de fabricare a fost efectuat
RoHS
RoHS
Certificat de conformitate produs