BGA-STD-050
Heat Sink, For Ball Grid Array, Standard, 14 °C/W, BGA, 20 mm, 19.1 mm, 20 mm
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| Cantitate | Preț (fără TVA) |
|---|---|
| 1+ | 19,000 lei |
| 10+ | 13,110 lei |
| 25+ | 12,240 lei |
| 50+ | 11,530 lei |
| 100+ | 9,450 lei |
Detalii tehnice
Prezentare generală a produsului
The BGA-STD-050 is a 20mm standard Heat Sink with aluminium, black anodized, thermal tape, 14°C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.
- 0.27mm Thickness
Aplicaţii
HVAC
Specificaţii tehnice
14°C/W
20mm
20mm
Aluminium
0.752"
-
No SVHC (17-Jan-2023)
BGA
19.1mm
-
0.79"
0.79"
-
Documentaţie tehnică (1)
Produse asociate
4 produse găsite
Legislaţie şi reglementări privind protecţia mediului
Tara in care ultimul proces semnificativ de fabricare a fost efectuatŢara de origine:Great Britain
Tara in care ultimul proces semnificativ de fabricare a fost efectuat
RoHS
RoHS
Certificat de conformitate produs