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Cantitate | Preț (fără TVA) |
---|---|
1+ | 23,720 lei |
10+ | 23,420 lei |
100+ | 23,110 lei |
250+ | 21,290 lei |
Detalii tehnice
Prezentare generală a produsului
Molex's SpeedEdge Edge-Card connector system is rugged enough to mate safely with large PCBs in high-cycle applications while providing a high-density, low-profile solution with data rates to over 40 Gbps per differential pair. They are mechanically robust with thicker walls and higher stack height when compared to other mezzanine systems and securely hold thick PCBs; delivers durability and high-mating cycles. The Split-pad PCB design allows for electrical tuning performance to reach data rates to over 40 Gbps per differential pair.
- Voltage (max) is 250VAC
- Current (max) is 1.0A per pin
- Contact resistance is 20mohm
- Dielectric withstanding voltage is 300VAC
- Insulation resistance is 10Mohm
Aplicaţii
Communications & Networking, Consumer Electronics, Aerospace, Defence, Military, Medical
Specificaţii tehnice
Dual Side
0.8mm
Surface Mount
2Rows
Copper Alloy
LCP (Liquid Crystal Polymer) Body
No SVHC (21-Jan-2025)
1.57mm
60 Contacts
Straight
Solder
30µ" Gold Plated Contacts
SpeedEdge 173300
Documentaţie tehnică (3)
Alternative pentru 173300-0106
1 produs găsit
Legislaţie şi reglementări privind protecţia mediului
Tara in care ultimul proces semnificativ de fabricare a fost efectuatŢara de origine:China
Tara in care ultimul proces semnificativ de fabricare a fost efectuat
RoHS
RoHS
Certificat de conformitate produs